MEMS, Microfluidics and Microsystems Executive Review

Groups partner on TSV process development for 3D MEMS and IC integration

EV Group (EVG), a supplier of wafer bonding equipment for the MEMS, nanotechnology and semiconductor markets, and the Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR), announced that they have entered into a two-year cooperation agreement to advance 3D IC integration technologies.  By minimizing interconnect length, 3D IC integration offers more flexibility in the designs and can operate at higher clock rates and consume less power.  The development in 3D IC also significantly simplifies chip-to-chip communications and the data transfer among the processing elements, enabling faster signal and data throughput so that high-frequency and high-transfer rates can be achieved.

IMEC crafts SiGe MEMS foundry

by R. Colin Johnson
Contributing Editor, MEMS Investor Journal

IMEC, Europe's largest independent research center in MEMS and nanotechnology, is offering a monolithically integrated silicon-germanium (SiGe) MEMS process as a foundry service.  IMEC’s new MEMS fabrication capability extends its more-than-CMOS (CMORE) initiative to include a new polysilicon-germanium process that allows both the CMOS and MEMS devices on the same chip.  Polysilicon-germanium can be deposited at significantly lower temperatures than traditional polysilicon, permitting MEMS devices to be fabricated atop already finished CMOS chips without damaging their delicate circuitry.

Baolab emerges as a CMOS MEMS player

As the industry is pushing for further integration of CMOS and MEMS chips, a startup company Baolab claims that it has developed a process with which a variety of MEMS devices can be made on standard CMOS lines.  We recently spoke with David Doyle, the company’s CEO, about the process’ advantages and limitations as well as competitive CMOS MEMS efforts from other companies and industry groups.

Overview of TSV process options

There is an increasingly expanding interest in through-wafer via (TWV) and through-silicon via (TSV) technologies.  In this comprehensive interview, we discuss TWV and TSV process options with Chris Gudeman, VP Process Development at Innovative Micro Technology.  Dr. Gudeman comments on material and process selection, costs, technology development challenges and trends as well as relevant applications such as RF, magnetics and interposers.

APM ships MEMS pressure sensor elements to automotive industry

Asia Pacific Microsystems announced that it has shipped over 2 million MEMS pressure sensor elements to a leading global automotive electronic company.   APM provides MEMS foundry services for the piezoresistive sensor elements which are key components for the pressure sensor business.   With this customer, the first production was launched in May 2009 with additional product families following in early 2010.   APM is shipping the sensor elements to this first tier customer’s plant for module assembly and calibration.  "We are really proud of passing the tough quality requirement of automotive industry and being a supplier to a leading automotive technology company.  This qualification is a major recognition of APM’s advanced technology, superior quality and cost leadership," said Dr. YH Tsai, President of APM.

APM claims to be a pure-play MEMS wafer foundry founded in 2001.  The company stated that its MEMS wafer foundry service is run in a 27,000 square foot 6-inch MEMS facility.   APM is  affiliated company of United Microelectronics Corporation.

MEMS in Europe: A perspective from TRONIC'S Microsystems

TRONIC'S Microsystems was founded in 1997 as a spin-off from LETI.  The company has enjoyed impressive growth and is one of the leading MEMS foundries in the world.  We recently spoke with TRONIC'S CEO Peter Pfluger about the interesting start ups they are seeing in Europe, the new Minatec MEMS and nanotechnology center as well as other interesting insights and trends in the MEMS industry.

Interview with IMT’s CEO John Foster

Based in Santa Barbara, Innovative Micro Technology (IMT) is one of the leading MEMS foundries.  We recently spoke with John Foster, the CEO of the company.  In the interview, he talks about his company’s recent projects as well as some general trends in the MEMS industry.

Micralyne builds on success in the Asian market

(Press Release) -- Micralyne Inc., a world-leading manufacturer of MEMS based industrial components, reports success penetrating the emerging MEMS market in Asia.  Building on its position as one of the largest independent MEMS foundries in North America, Micralyne has successfully extended its reach to Asia by serving market leading companies in Japan and China.

Optimizing MEMS Manufacturing

Tight control of manufacturing flows and yield is one of the essential factors for success with MEMS manufacturers.  We recently spoke with Dan Estrada, Vice President of Eyelit, whose company provides software systems to help manufacturers achieve greater fabrication efficiencies and profitability.  Eyelit already has a number of clients in the MEMS industry and continues to expand its work with companies in our space. 

We were also able to obtain comments from two of Eyelit's customers, Innovative Micro Technology (IMT) and VTI -- Michael Shillinger, IMT's VP Operations, and Sampo Hämäläinen, VTI's Process Development and Manufacturing Manager, provided feedback from their companies. 

MEMS at Freescale

We recently spoke with Dave Monk, Freescale's Silicon Technology and Microsystems manager.